TE 501 REPAIR MAT

বিস্তারিত TE 501 REPAIR MATPrecision Soldering Simplified: The TE-501 Thermal Insulation Repair MatMaximize your focus with the TE-501 Professional Repair Mat. This high-density silicone pad is engineered for the heat-intensive world of micro-soldering and BGA rework. With a thermal resistance rating of up to 500°C, it allows you to work confidently with hot air stations and soldering irons directly on the surface.The TE-501 features a streamlined design that includes essential organizational slots for screws and small components, making it the perfect companion for iPhone logic board repairs, Android IC swaps, and delicate FPC connector replacements.Key Features:Industrial-Grade Heat Resistance: Withstands direct contact with heat up to 500°C, protecting your work surface from burns, warping, and permanent damage.Compact & Focused Layout: The smaller footprint is ideal for placing under a microscope or for technicians with limited bench space.Anti-Slip Silicone Grip: The specialized texture ensures that your motherboard stays exactly where you put it, preventing slips during delicate jumper wire work.Essential Organization: Includes molded compartments to categorize screws and ICs, reducing the risk of component loss during complex repairs.Easy-Clean Surface: Highly resistant to solder flux, lead-free paste, and chemical cleaners like IPA. A quick wipe restores the mat to its original condition.Static-Safe Protection: Made from anti-static materials to safeguard sensitive CMOS and CPU chips from ESD (Electrostatic Discharge).